Collaborative Manufacturing Process Redesign Using Sentiment Analysis
Zusammenfassung
We present a novel tool called SentiProMo which uses sentiment analysis on collaborative comments collected during the design phase of business and manufacturing processes. This method involves the implicit information of sentiment hidden behind the suggestions for the process improvements. To discover and utilize the sentiment for process redesign we trained and tested a sentiment analysis module as part of our software. This module classifies and scores the sentiment of comments and acts as a part of SentiProMo tool for role based BPMN modeling and annotation. In order to evaluate the usability of the proposed software we tested it with a specific scenario including tasks with representative test persons. For this purpose we used standardized surveys like Computer System Usability Questionnaire (CSUQ) and Nielsen’s Heuristic model (NHE) to obtain the insights on usability of the system.
- Vollständige Referenz
- BibTeX
Softic, S., Lüftenegger, E. & Stojic, A.,
(2021).
Collaborative Manufacturing Process Redesign Using Sentiment Analysis.
In:
Wienrich, C., Wintersberger, P. & Weyers, B.
(Hrsg.),
Mensch und Computer 2021 - Workshopband.
Bonn:
Gesellschaft für Informatik e.V..
DOI: 10.18420/muc2021-mci-ws04-380
@inproceedings{mci/Softic2021,
author = {Softic, Selver AND Lüftenegger, Egon AND Stojic, Aleksandar},
title = {Collaborative Manufacturing Process Redesign Using Sentiment Analysis},
booktitle = {Mensch und Computer 2021 - Workshopband},
year = {2021},
editor = {Wienrich, Carolin AND Wintersberger, Philipp AND Weyers, Benjamin} ,
doi = { 10.18420/muc2021-mci-ws04-380 },
publisher = {Gesellschaft für Informatik e.V.},
address = {Bonn}
}
author = {Softic, Selver AND Lüftenegger, Egon AND Stojic, Aleksandar},
title = {Collaborative Manufacturing Process Redesign Using Sentiment Analysis},
booktitle = {Mensch und Computer 2021 - Workshopband},
year = {2021},
editor = {Wienrich, Carolin AND Wintersberger, Philipp AND Weyers, Benjamin} ,
doi = { 10.18420/muc2021-mci-ws04-380 },
publisher = {Gesellschaft für Informatik e.V.},
address = {Bonn}
}
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Mehr Information
Datum: 2021
Sprache:
(en)
(en)
Typ: Text/Conference Poster

